Thin Film Deposition: Trends, Key Issues, Market Analysis
Chapter 1 Introduction 1-1
Chapter 2 Executive Summary 2-1
Chapter 3 Physical Vapor Deposition 3-1
3.1 Introduction 3-1
3.2 Sputtering Technology 3-2
3.3 Plasma Technology 3-5
3.4 Reactor Designs 3-14
3.4.1 Long-Throw Deposition 3-14
3.4.2 Collimated Sputter Deposition 3-16
3.4.3 Showerhead Deposition 3-18
3.4.4 Ionized PVD 3-22
3.5 Semiconductor Processing 3-28
3.5.1 Feature Patterning 3-28
3.5.2 Gap Fill 3-31
3.6 Targets 3-34
Chapter 4 Chemical Vapor Deposition 4-1
4.1 Introduction 4-1
4.2 Chemical Vapor Deposition (CVD) Techniques 4-1
4.2.1 APCVD 4-1
4.2.2 LPCVD 4-6
4.2.3 PECVD 4-9
4.2.4 HDPCVD 4-13
4.2.5 ALD 4-19
Chapter 5 Electrochemical Deposition 5-1
5.1 Introduction 5-1
5.2 Reactor Design 5-5
5.3 Challenges 5-6
5.4 Additives 5-8
5.5 Processing 5-9
5.5.1 Superfilling 5-9
5.5.2 Aspect Ratios 5-9
5.6 Copper Cathodes 5-10
5.7 Wet Copper Seed-Layer 5-11
Chapter 6 Film Deposition And Film Properties 6-1
6.1 Introduction 6-1
6.2 Dielectric Deposition 6-4
6.2.1 Silicon Dioxide 6-5
6.2.1.1 Thermal CVD 6-5
6.2.1.2 PECVD 6-6
6.2.1.3 HDPCVD 6-9
6.2.2 Silicon Nitride 6-13
6.2.2.1 Thermal CVD 6-13
6.2.2.2 PECVD 6-14
6.2.2.3 HDPCVD 6-19
6.2.3 High-K Dielectrics 6-19
6.2.4 Low-K Dielectrics 6-22
6.3 Metal Deposition 6-23
6.3.1 Aluminum 6-23
6.3.2 Tungsten/Tungsten Silicide 6-26
6.3.3 Titanium Nitride 6-28
Chapter 7 Vendor Issues 7-1
7.1 Introduction 7-1
7.2 300mm Processing 7-6
7.3 Integrated Processing 7-8
7.4 Copper 7-12
7.5 Metrology 7-15
7.6 ESD 7-18
7.7 Parametric Test 7-19
Chapter 8 Market Forecast 8-1
8.1 Introduction 8-1
8.2 Key Issues 8-4
8.3 Market Forecast Assumptions 8-7
8.4 Market Forecast 8-8
8.4.1 Chemical Vapor Deposition 8-8
8.4.2 Physical Vapor Deposition 8-28
8.4.3 Copper Electroplating Market 8-32
8.4.4 Atomic Layer Deposition Market 8-36
FIGURES
Page
3.1 Schematic Of Sputtering System 3-3
3.2 Magnetron Sputtering Design 3-9
3.3 Showerhead Reactor Design 3-19
3.4 Ionized PVD 3-24
4.1 APCVD Reactor 4-3
4.2 Tube CVD Reactor 4-7
4.3 HDPCVD Reactor 4-17
4.4 ALD Versus PVD Copper Barrier 4-26
5.1 Copper Electroplating System 5-3
7.1 Comparison Between Semiconductor and Equipment Revenues 7-4
8.1 Worldwide MCVD Market Shares 8-12
8.2 Worldwide DCVD Market Shares 8-13
8.3 Worldwide DCVD Market By Sectors 8-15
8.4 Worldwide HDHCVD Market Shares 8-18
8.5 Worldwide PECVD Market Shares 8-21
8.6 Worldwide SACVD Market Shares 8-24
8.7 Worldwide LPCVD Market Shares 8-27
8.8 Worldwide PVD Market Shares 8-31
8.9 Worldwide ECD Market Shares 8-34
8.10 Worldwide ALD Market Shares 8-38
TABLES
Page
8.1 Worldwide CVD Market Forecast 8-9
8.2 Worldwide MCVD Market Shares 8-10
8.3 Worldwide DCVD Market Shares 8-11
8.4 Worldwide HDPCVD Market Forecast 8-16
8.5 Worldwide HDPCVD Market Shares 8-17
8.6 Worldwide PECVD Market Forecast 8-19
8.7 Worldwide PECVD Market Shares 8-20
8.8 Worldwide SACVD Market Forecast 8-22
8.9 Worldwide SACVD Market Shares 8-23
8.10 Worldwide LPCVD Market Forecast 8-25
8.11 Worldwide LPCVD Market Shares 8-26
8.12 Worldwide PVD Market Forecast 8-29
8.13 Worldwide PVD Market Shares 8-30
8.14 Worldwide ECD Market Forecast 8-33
8.15 Worldwide ALD Market Forecast 8-37
